Adaptive Patterning Design Methodologies
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545403.pdf?arnumber=7545403
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Deca & ASE M-Series Bridge Die Compensation & Adaptive Patterning in a Multi-Die Module in 600 mm Format;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Integrating Chiplets using Chips First Ultra-High-Density Fan-out with Maskless Laser Direct Imaging and Adaptive Patterning for High Performance Computing;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Mask-less Laser Direct Imaging & Adaptive Patterning Solution for Fan-Out Heterogeneous Integration on 600mm;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
5. Panel Level Packaging – Where are the Technology Limits?;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
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