A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application

Published:2024-05-28 Issue: Volume:20 Page:1868-1871
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Wang Terry¹,Lu Chih Wei¹,Feng Eric¹,Yang Yu-Jhen¹,Chang Cheng-Yueh¹,Cheng Pei-Pei¹,Lie Fredrick²,Cheng Austin³,Huang Hsin-Yi⁴,Koh Meiten⁵,Wiatrowska Aneta⁶,Witczak Łukasz⁶

Affiliation:

1. Industrial Technology Research Institute (ITRI),Electonic and OptoelectronicSystem Research Laboratories (EOSL),Hsinchu,Taiwan

2. Applied Materials Inc.,Digital Lithography Group (DLG),Santa Clara,CA,USA

3. FAVITE Inc.,Equipment Development Business Unit, Software Development Department,Hsinchu,Taiwan

4. Everlight Chemical Industrial Corp.,R & D, Electronic Chemicals Business Unit,Hsinchu,Taiwan

5. TAIYO INK MFG. CO., LTD,Saitama,Japan

6. XTPL S.A.,Wrocław,Poland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565264.pdf?arnumber=10565264

Reference10 articles.

1. Overview of Fan-out Wafer Level Package (FO-WLP)

2. Development and characterization of new generation panel fan-out (P-FO) packaging technology

3. Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

4. Design, Material, Process, and Equipment of Embedded Fan-Out Wafer/Panel-Level Packaging;Lau;Chip Scale Review,2016

5. A Novel Inorganic Substrate by Three Dimensionally Stacked Glass Core Technology

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP