1. A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Thermal multiscale simulation of a FO-WLP SiP including a GaN Power Amplifier;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Scaling of redistribution layer for Heterogeneous packaging in a panel level;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Study of reliable via structure for Fan Out Panel Level Package (FoPLP);2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Development of Photosensitve Polyimide B-stage Sheet Having High Cu Migration Resistance;Journal of Photopolymer Science and Technology;2017