Integrating Chiplets using Chips First Ultra-High-Density Fan-out with Maskless Laser Direct Imaging and Adaptive Patterning for High Performance Computing-Reference-Cited by-同舟云学术

Integrating Chiplets using Chips First Ultra-High-Density Fan-out with Maskless Laser Direct Imaging and Adaptive Patterning for High Performance Computing

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Jose Benedict San¹,Sandstrom Cliff¹,Talain Erick¹,Kellar Jan¹,Olson Tim¹,Melgo Mary Maye²,Gacho Rizi²,Kim BC²

Affiliation:

1. Deca Technologies Inc.,Tempe,AZ,USA

2. nepes hayyim Corporation,Laguna,Philippines

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195614.pdf?arnumber=10195614

Reference10 articles.

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3. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

4. M-Series Fan-Out with Adaptive Patterning;olson;Advances in Embedded and Fan-Out Wafer Level Packaging Technologies,2018

5. Post-Moore's Law electronics: now until quantum electronics;Chip Scale Review,2020

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