Deca & Cadence Breakthrough Heterogeneous Integration Barriers with Adaptive Patterning™
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501665.pdf?arnumber=9501665
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of UV-curable molding materials with minimum die-shift for FOWLP/FOPLP;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. TrueAdaptTM- AI Based Maskless Patterning to Compensate for Die-Shift in Fan-Out Wafer Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Integrating Chiplets using Chips First Ultra-High-Density Fan-out with Maskless Laser Direct Imaging and Adaptive Patterning for High Performance Computing;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
5. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023
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