Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias-Reference-Cited by-同舟云学术

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Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
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Author:

Sukumaran Vijay,Bandyopadhyay Tapobrata,Chen Qiao,Kumbhat Nitesh,Liu Fuhan,Pucha Raghu,Sato Yoichiro,Watanabe Mitsuru,Kitaoka Kenji,Ono Motoshi,Suzuki Yuya,Karoui Choukri,Nopper Christian,Swaminathan Madhavan,Sundaram Venky,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5871442/5898472/05898571.pdf?arnumber=5898571

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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