Analysis and mitigation of stress induced by rapid formation of through glass vias in thin substrates-Reference-Cited by-同舟云学术

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Analysis and mitigation of stress induced by rapid formation of through glass vias in thin substrates

Published:2023-03-17 Issue: Volume: Page:
ISSN:
Container-title:Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII
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Author:

Matsumoto Hisashi,Lin Zhibin,Schrauben Joel N.,Kleinert Jan

Publisher

SPIE

Reference44 articles.

1. Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias;Sukumaran,2011

2. Precision drilling of fused silica with 157-nm excimer laser radiation

3. Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging

4. Advances in CO2-Laser Drilling of Glass Substrates

5. Micro-laser drilling on glass substrates with pulsed co2 lasers;Nakamura,2013

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling;Applied Physics A;2023-03-23

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