Correlation between Cu microstructure and TSV Cu pumping-Reference-Cited by-同舟云学术

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Correlation between Cu microstructure and TSV Cu pumping

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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Author:

De Messemaeker Joke,Pedreira Olalla Varela,Philipsen Harold,Beyne Eric,De Wolf Ingrid,Van der Donck Tom,Croes Kristof

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897349.pdf?arnumber=6897349

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding;Applied Surface Science;2024-11

2. Minimizing Recess of Cu Pad on Hybrid Bonding with SiCN via Non-selective Chemical Mechanical Polishing and Post-cleaning Steps;ECS Journal of Solid State Science and Technology;2024-07-01

3. Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN–SiCN Wafer-to-Wafer Hybrid-Bonding Technologies;IEEE Transactions on Device and Materials Reliability;2023-12

4. Cu Pumping Analysis During $\text{Cu}/\text{SiO}_{2}$ Hybrid Bonding Using In-Situ SPM Imaging;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

5. Fabrication and Characterization of Thin Metal Films Deposited by Electroless Plating with Organic Additives for Electrical Circuits Applications;Micromachines;2023-05-29

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