Reduction of lead free solder aging effects using doped SAC alloys-Reference-Cited by-同舟云学术

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Reduction of lead free solder aging effects using doped SAC alloys

Published:2010 Issue: Volume: Page:
ISSN:
Container-title:2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
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Author:

Cai Zijie,Zhang Yifei,Suhling Jeffrey C.,Lall Pradeep,Johnson R. Wayne,Bozack Michael J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5482824/5490635/05490796.pdf?arnumber=5490796

Cited by 66 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Finite-element stress and strain analysis of tin–silver–copper solders exposed to isothermal ageing at 100° C;Welding International;2024-06-24

2. Influence of Nickel and Bismuth Addition on the Mechanical Shear Strength of SAC+ Ni, Bi Solders under Isothermal Aging and Multiple Reflows;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging;Journal of Electronic Packaging;2024-03-11

5. Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution;Microelectronics Reliability;2024-01

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