Self-heating and its implications on hot carrier reliability evaluations
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7106273/7112653/07112726.pdf?arnumber=7112726
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electrothermal Effects on Hot Carrier Injection Reliability of n-Type FinFETs in Ring Oscillators;IEEE Transactions on Electron Devices;2024-02
2. Ring Oscillator Aging Characterization in Conventional CMOS Technologies;2023 37th Symposium on Microelectronics Technology and Devices (SBMicro);2023-08-28
3. Device-Level Thermal Management in Multifin SOI-FinFET Through Fin Pitch Design Employing Cooperative Game Theory;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06
4. Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI;IEEE Transactions on Device and Materials Reliability;2022-09
5. Ab Initio Electrical, Thermal Conductance, and Lorenz Numbers for Advanced CMOS Interfaces;IEEE Transactions on Electron Devices;2022-05
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