Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI-Reference-Cited by-同舟云学术

Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI

Published:2022-09 Issue:3 Volume:22 Page:387-395
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Chohan Talha¹^ORCID,Zhao Zhixing¹,Lehmann Steffen¹,Arfaoui Wafa¹,Bossu Germain¹,Trommer Jens²^ORCID,Slesazeck Stefan²^ORCID,Mikolajick Thomas²^ORCID,Siddabathula Mahesh¹

Affiliation:

1. GlobalFoundries, Dresden, Germany

2. Reconfigurable Devices Group, NaMLab gGmbH, Dresden, Germany

Funder

Globalfoundries Dresden Module One within the framework Important Project of Common European Interest

Federal Ministry for Economics and Energy

State of Saxony

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/7298/9876000/09797872.pdf?arnumber=9797872

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