Growth kinetics of intermetallic compound in solder joints during thermal cycling: a review-Reference-Cited by-同舟云学术

Growth kinetics of intermetallic compound in solder joints during thermal cycling: a review

Published:2021-12-07 Issue: Volume: Page:
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Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Xu Junmeng,Guo Ying,Su Yutai,Tang Ruitao,Long Xu

Funder

Natural Science Foundation of Shaanxi Province

Fundamental Research Funds for the Central Universities

Research and Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663867.pdf?arnumber=9663867

Reference22 articles.

1. Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates;ji;Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2012 13th International Conference on,2012

2. Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints

3. Effect of temperature on interface diffusion in micro solder joint under current stressing

4. Intermetallic growth studies on SAC/ENIG and SAC/CU-OSP lead-free solder joints

5. Isothermal and thermal cycling aging on IMC growth rate in Pb-free and Pb-based solder interfaces

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