Effect of temperature on interface diffusion in micro solder joint under current stressing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference18 articles.
1. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages [J];CHAN;Progress in Materials Science,2010
2. Microstructure evolution of Cu-cored Sn solder joints under high temperature and high current density [J];SA;Journal of Electronic Materials,2013
3. Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump [J];JEONG;Microelectronic Engineering,2012
4. Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints [J];CHAO;Microelectronics Reliability,2009
5. Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints [J];OTHMAN;Intermetallics,2012
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1. Evolution of the grain size gradient and its effect on the mechanical and electrical properties of metal interconnects;Materials Science in Semiconductor Processing;2022-11
2. Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder joint;Transactions of Nonferrous Metals Society of China;2022-10
3. Growth kinetics of intermetallic compound in solder joints during thermal cycling: a review;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
4. Formation mechanism of Cu/Cu3Sn–Cu/Cu interconnections based on solder-filled microporous copper as interlayer via a current-assisted thermal compression bonding;Modern Physics Letters B;2021-04-16
5. Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory;Microelectronics Reliability;2020-04
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