Isothermal and thermal cycling aging on IMC growth rate in Pb-free and Pb-based solder interfaces-Reference-Cited by-同舟云学术

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Isothermal and thermal cycling aging on IMC growth rate in Pb-free and Pb-based solder interfaces

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Container-title:The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)
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Author:

Pang J.H.L.,Prakash K.H.,Low T.H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9211/29212/01318265.pdf?arnumber=1318265

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Growth kinetics of intermetallic compound in solder joints during thermal cycling: a review;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

2. Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites;Journal of Materials Science: Materials in Electronics;2016-05-11

3. Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging;Journal of Materials Science: Materials in Electronics;2013-02-24

4. Gold-Aluminum Intermetallic Formation Kinetics;2006 IEEE International Reliability Physics Symposium Proceedings;2006-03

5. Assessing the Probability of Bankruptcy;SSRN Electronic Journal;2002

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