Optical fiber pigtails integration in co-package-Reference-Cited by-同舟云学术

Optical fiber pigtails integration in co-package

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Janta-Polczynski Alexander¹,Robitaille Martin²

Affiliation:

1. IBM Canada,Advanced Packaging,Bromont,Canada

2. Lx Sim,Modeling Engineer,Bromont,Canada

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816662.pdf?arnumber=9816662

Reference9 articles.

1. Novel, High-Throughput, Fiber-to-Chip Assembly Employing Only Off-the-Shelf Components

2. Towards co-packaging of photonics and microelectronics in existing manufacturing facilities;janta-polczynski;SPIE Proceeding,2018

3. A Multi Chip Module (MCM) with Energy Efficient In-package 53Gbps x 16-lambda WDM Optical Transceiver for PIPES (Photonics in the Package for Extreme Scalability);frans,0

4. Co-Packaged Optics Sockets for CPO;janta;Optical Internetworking Forum (OIF),0

5. Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions

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1. Co-packaged Optics;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

2. Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Advances in UV-lithographic patterning of multi-layer waveguide stack for single mode polymeric RDL;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13