Advances in UV-lithographic patterning of multi-layer waveguide stack for single mode polymeric RDL
Author:
Affiliation:
1. Institute of Electronic Packaging Technology, Technical University of Dresden,Dresden,Germany,D-01062
Funder
Federal Ministry of Education and Research
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939517.pdf?arnumber=9939517
Reference15 articles.
1. Analysis of polymeric singlemode waveguides for inter-system communication
2. Hybrid lithography approach for single mode polymeric waveguides and out-of-plane coupling mirrors
3. Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
4. Design and optimization of planar multimode waveguides for high speed board-level optical interconnects
5. Development of a wafer-level integration technology for photonic transceivers based on planar lightwave circuits
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1. Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
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