Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling
Author:
Affiliation:
1. Institute of Electronic Packaging Technology, Technical University of Dresden,Dresden,Germany,D-01062
Funder
Germany's Federal Ministry of Education and Research (BMBF)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418392.pdf?arnumber=10418392
Reference16 articles.
1. Advanced Packaging Technologies for Copackaged Optics
2. Demonstration of Fan-out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO) Application
3. A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications
4. Optical fiber pigtails integration in co-package
5. Hybrid photonic integration on a polymer platform;Zhang;Photonics,2015
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