Author:
Janta-Polczynski Alexander,Cyr Elaine,Langlois Richard,Fortier Paul,Taira Yoichi,Boyer Nicolas,Barwicz Tymon
Cited by
13 articles.
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1. Laser Attach Process Development and Material Selection;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Fiber array attach for co-packaged optics: high volume production process control and performance;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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4. Silicon photonic co-packaging: Adhesive dispense challenge and control;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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