Co-design and Signal-Power Integrity/EMI Co-analysis of a Switchable High-speed Inter-Chiplet Serial Link on an Active Interposer-Reference-Cited by-同舟云学术

Co-design and Signal-Power Integrity/EMI Co-analysis of a Switchable High-speed Inter-Chiplet Serial Link on an Active Interposer

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Miao Min¹,Duan Xiaolong¹,Sun Liang¹,Li Tao¹,Zhu Shiliang¹,Zhang Zhuanzhuan¹,Li Jin¹,Zhang Danya¹,Wen Hao¹,Liu Xuena¹,Li Zhensong¹

Affiliation:

1. Beijing Information Science and Technology University,A Member of Key Laboratory of the Ministry of Education for Optoelectronic Measurement Technology & Instrument,Academy of Smart IC and Network (ASICNet),Beijing,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816691.pdf?arnumber=9816691

Reference2 articles.

1. Modeling and Design of Power Distribution Network for a Heterogeneous Integrated Active Interposer with Neuromorphic Computing Circuits

2. The Open Domain-Specific Architecture

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