Author:
Vinnakota Bapi,Agarwal Ishwar,Drucker Kevin,Jani Dharmesh,Miller Gary,Mittal Millind,Wang Robert
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
5 articles.
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1. Chipletizer: Repartitioning SoCs for Cost-Effective Chiplet Integration;2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC);2024-01-22
2. Co-design and Signal-Power Integrity/EMI Co-analysis of a Switchable High-speed Inter-Chiplet Serial Link on an Active Interposer;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. SCIP to the Next Generation of Computing: Extending More than Moore with Silicon Photonics Chiplets in Package (SCIP);2022 23rd International Symposium on Quality Electronic Design (ISQED);2022-04-06
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5. The Open Domain-Specific Architecture;Proceedings of the Eight Annual ACM International Conference on Nanoscale Computing and Communication;2021-09-07