Publisher
Springer Science and Business Media LLC
Reference63 articles.
1. Bharadwaj, S., Yin, J., Beckmann, B., Krishna, T.: Kite: a family of heterogeneous interposer topologies enabled via accurate interconnect modeling. In: Proceedings of the 57th ACM/IEEE Design Automation Conference, pp. 1–6. (2020)
2. Cadence: 3D-IC Design Solutions (2021). https://www.cadence.com/en_US/home/solutions/3dic-design-solutions.html
3. Carusone, A.C., Dehlaghi, B., Beerkens, R., Tonietto, D.: Ultra-short-reach interconnects for package-level integration. In: Proceedings of the IEEE Optical Interconnects Conference, pp. 10–11. (2016)
4. CCIX Consortium: Cache Coherent Interconnect for Accelerators (2017). http://www.ccixconsortium.com
5. DARPA: Common heterogeneous integration and ip reuse strategies (chips) (2021) https://www.darpa.mil/program/commonheterogeneous-integration-and-ip-reuse-strategies.
Cited by
22 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献