1. https://www.darpa.mil/program/compound-semiconductor-materials-on-silicon
2. https://www.darpa.mil/program/dahi-compound-semiconductor-materials-on-silicon
3. https://www.darpa.mil/program/common-heterogeneous-integration-and-ip-reuse-strategies
4. https://nstxl.org/opportunity/state-of-the-art-heterogeneous-integrated-packaging-ship-prototype-project/
5. Lau, J. H. (2021). Semiconductor advanced packaging. Springer.