Numerical Evaluation on SiO2 Based Chip to Wafer Hybrid Bonding Performance by Finite Element Analysis
Author:
Affiliation:
1. A*STAR (Agency for Science, Technology, and Research),Institute of Microelectronics,Singapore,138634
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816432.pdf?arnumber=9816432
Reference5 articles.
1. Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages
2. Bonding integrity enhancement in wafer to wafer fine pitch hybrid bonding by advanced numerical modelling
3. A kinetic model of copper-to-copper direct bonding under thermal compression
4. Modelling and characterization on wafer to wafer hybrid bonding technology for 3D IC packaging
5. Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
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