Characteristics of Glass-Embedded FOAiP with Antenna Arrays for 60GHz mmWave Applications-Reference-Cited by-同舟云学术

Characteristics of Glass-Embedded FOAiP with Antenna Arrays for 60GHz mmWave Applications

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Lin I-Hung¹,Lin Cheng-Chen²,Pan Ying-Chieh¹,Lwo Ben-Je²,Ni Tom¹

Affiliation:

1. Hon HainTechnology Group,Hsinchu,Taiwan,R. O. C

2. National Defense University,Department of Mechanical and Aerospace Engineering,Taoyuan City,Taiwan,R.O.C.

Publisher

IEEE

Link

Reference18 articles.

3. Integrated Fan Out Antenna and Method of Forming the Same;wang;United States Patent US 9 843 106 B2,2017

4. Wafer level package with at least one integrated antenna element;ndip;United States Patent US,2018

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