High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan, R.O.C.
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816724.pdf?arnumber=9816724
Reference11 articles.
1. 3D Multi-chip Integration with System on Integrated Chips (SoIC™)
2. Pixel/DRAM/logic 3-layer stacked CMOS image sensor technology
3. Two-step fabrication process for die-to-die and die-to-wafer Cu-Cu bonds
4. Low Temperature SoIC™ Bonding and Stacking Technology for 12/16-Hi High Bandwidth Memory (HBM)
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3. Reliability Performance on Fine-Pitch SoIC™ Bond;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N;IEEE Journal of the Electron Devices Society;2023
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