Two-step fabrication process for die-to-die and die-to-wafer Cu-Cu bonds-Reference-Cited by-同舟云学术

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Two-step fabrication process for die-to-die and die-to-wafer Cu-Cu bonds

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Ong Jia Juen,Shie Kai-Cheng,Tu King-Ning,Chen Chih

Funder

Ministry of Education (MOE) in Taiwan

Ministry of Science and Technology, Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501673.pdf?arnumber=9501673

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Patterned Cu Nanoparticle Film for All-Cu Interconnection Without Chemical Mechanical Polishing Pretreatment;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05

3. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03

4. Cu-Cu Hybrid Bonding;Chiplet Design and Heterogeneous Integration Packaging;2023

5. High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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