Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process-Reference-Cited by-同舟云学术

Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Chowdhury Prabudhya Roy¹,Sakuma Katsuyuki¹,Raghavan Sathya¹,Bergendahl Marc¹,Sikka Kamal¹,Kohara Sayuri²,Hisada Takashi²,Mori Hiroyuki²,Taneja Divya³,De Sousa Isabel³

Affiliation:

1. IBM Research,AI Hardware Research Center,Albany and Yorktown,NY,US

2. IBM Research,Tokyo,Japan

3. IBM Systems,Bromont,Canada

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816576.pdf?arnumber=9816576

Reference7 articles.

1. Development of Self-releasing adhesive tape as a temporary bonding material for 3D integration

2. Demonstration of a Low Latency (<20 ps) Fine-pitch (≤10 μm) Assembly on the Silicon Interconnect Fabric

3. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

4. Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

5. Scalable Chiplet package using Fan-Out Embedded Bridge

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