Development of Self-releasing adhesive tape as a temporary bonding material for 3D integration
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159519.pdf?arnumber=9159519
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Temporary Protective Packaging for Vertical Integration of Optical-Window-Free TSV-Based Micromirror Array;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
2. Development of Thermal Resistant Temporary Bonding Material for Fan-out Wafer Level Packaging: Dual-curing and Dual-debonding Strategies are Available;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. A Temporary Bonding De-Bonding Tape with High Thermal Resistance and Excellent TTV for 3DIC;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
4. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31
5. Fantastic bonding: makes fabrication on Kapton films effortless for 2D material devices;2022 IEEE 22nd International Conference on Nanotechnology (NANO);2022-07-04
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