Development of Thermal Resistant Temporary Bonding Material for Fan-out Wafer Level Packaging: Dual-curing and Dual-debonding Strategies are Available-Reference-Cited by-同舟云学术

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Development of Thermal Resistant Temporary Bonding Material for Fan-out Wafer Level Packaging: Dual-curing and Dual-debonding Strategies are Available

Published:2023-08-08 Issue: Volume:180 Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Li Kang¹,Bai Yun¹,Liu Qiang¹,Jiang Guoming¹,Liu Yanting¹,Zeng Yalin¹,Dai Wenxue¹,Wang Xuefan¹,Zhang Guoping¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

Funder

National Natural Science Foundation of China

Engineering Laboratory

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492040.pdf?arnumber=10492040

Reference8 articles.

1. High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs

2. Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding

3. A Single-Layer Mechanical Debonding Adhesive for Advanced Wafer-Level Packaging

4. Development of Self-releasing adhesive tape as a temporary bonding material for 3D integration

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