Block Thermal Model for High Power Lidded Packages
Author:
Affiliation:
1. Broadcom Inc.,Irvine,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816625.pdf?arnumber=9816625
Reference7 articles.
1. Compact conduction model of ball grid array packages
2. Characterizing junction-to-case thermal resistance and its impact on end-use applications
3. Measurement and simulation of junction to board thermal resistance and its application in thermal modeling
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