Measurement and simulation of junction to board thermal resistance and its application in thermal modeling-Reference-Cited by-同舟云学术

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Measurement and simulation of junction to board thermal resistance and its application in thermal modeling

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Container-title:Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)
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Author:

Joiner B.,Adams V.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6173/16495/00762450.pdf?arnumber=762450

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