Simplified Thermal Modeling for Power Electronics: An Examination of Limitations and Best Practices in TO220 Package Devices
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Publisher
Springer Nature Switzerland
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-57022-3_7
Reference8 articles.
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2. Olabi, A.G., Abdelkareem, M.A., Wilberforce, T., et al.: Battery electric vehicles: progress, power electronic converters, strength (S), weakness (W), opportunity (O), and threats (T). Int. J. Thermofluids 16, 100212 (2022). https://doi.org/10.1016/j.ijft.2022.100212
3. Erb, D.C., Onar, O.C., Khaligh, A.: An Integrated Bi-Directional Power Electronic Converter with Multi-level AC-DC/DC-AC Converter and Non-inverted Buck-Boost Converter for PHEVs with Minimal Grid Level Disruptions, pp. 10–15 (2010)
4. Joiner, B., Adams, V.: Measurement and simulation of junction to board thermal resistance and its application in thermal modeling. Annu. IEEE Semicond. Therm. Meas. Manag. Symp. 212–220 (1999). https://doi.org/10.1109/stherm.1999.762450
5. Shahjalal, M., Lu, H., Bailey, C.: Electro-thermal modelling of multichip power modules for high power converter application. In: 18th Int Conf Electron Packag Technol ICEPT, pp. 940–945 (2017). https://doi.org/10.1109/ICEPT.2017.8046599
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