Electro-thermal modelling of multichip power modules for high power converter application
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8030508/8046389/08046599.pdf?arnumber=8046599
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Real-time Electro-thermal Simulations for Power Electronic Converters;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25
2. Simplified Thermal Modeling for Power Electronics: An Examination of Limitations and Best Practices in TO220 Package Devices;Springer Proceedings in Energy;2024
3. An Improved Electrothermal Modeling of Two-Level Inverter for Electric Vehicle Applications;2023 IEEE International Transportation Electrification Conference (ITEC-India);2023-12-12
4. IGBT Gate Boost Drive Technology for Promoting the Overload Capacity of Traction Converter;2023 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific);2023-11-28
5. Dynamic IGBT Three-dimensional Thermal Network Model Considering Base Solder Degradation and Thermal Coupling Between IGBT Chips;IEEE Transactions on Transportation Electrification;2022
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