CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design-Reference-Cited by-同舟云学术

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CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design

Published:2024-04-07 Issue: Volume:2017 Page:1-10
ISSN:
Container-title:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Erol Baris¹,May Daniel¹,Wunderle Bernhard¹

Affiliation:

1. Technische Universität Chemnitz,Germany

Funder

Rijksdienst voor Ondernemend Nederland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491471.pdf?arnumber=10491471

Reference36 articles.

1. Thermal and Mechanical Optimization to Enable Reliable High Performance Liquid-Cooled Compute System for Level 4 Autonomous Driving

2. Affordable and Safe High Performance Vehicle Computers with Ultra-Fast On-Board Ethernet for Automated Driving

3. The Architectural Implications of Autonomous Driving

4. Parametric FE-approach to flip-chip reliability under various loading conditions

5. Lidless and lidded Flip Chip Packages for Advanced Applications

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