Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps-Reference-Cited by-同舟云学术

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Sakuma Katsuyuki¹,Bonilla Griselda¹,McHerron Dale¹,Aoki Toyohiro²,Kastberg Russell³,Pomerantz Glenn³,Bunt Jay³,Wassick Tom³

Affiliation:

1. IBM T. J. Watson Research Center,Albany,NY,U.S.A.

2. IBM Research,Tokyo,Japan

3. IBM Systems,NY,U.S.A.

Publisher

IEEE

Link

Reference12 articles.

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