Local Thickness Control of Resist Mask Using Pad Density Dependence
Author:
Affiliation:
1. IBM Research – Tokyo, IBM Japan, Ltd.
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiep/27/5/27_472/_pdf
Reference14 articles.
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2. 2) K. Sikka, et al.: "Direct Bonded Heterogeneous Integration (DBHi) Si Bridge," IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 136–147
3. 3) Y. Morikawa, et al.: "A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect," IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, pp. 34–39
4. 4) P.-Y. Lin, et al.: "Reliability Performance of Advanced Organic Interposer (CoWoS-R) Packages," IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 723–728
5. 5) S. Miki, et al.: "Development of 2.3D High Density Organic Package using Low Temperature Bonding Process with Sn-Bi Solder," IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, pp. 1599–1604
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