A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect-Reference-Cited by-同舟云学术

A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Morikawa Yasuhiro¹,Koh Meiten²,Hashimoto Hiroyuki³,Chen Chuantong⁴,Wang Ye⁴,Kono Ichiro⁵,Wakisaka Shinji⁶,Ukawa Ken⁷,Fukushima Takafumi³,Suganuma Katsuaki⁴,Kurita Yoichiro⁸

Affiliation:

1. ULVAC, Inc,Shizuoka,Japan

2. TAIYO INK MFG. CO., LTD,Saitama,Japan

3. Tohoku University,Miyagi,Japan

4. Osaka University,Osaka,Japan

5. AOI Electronics,Kagawa,Japan

6. Oume Electronics,Tokyo,Japan

7. Sumitomo Bakelite,Fukuoka,Japan

8. Tokyo Institute of Technology,Kanagawa,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195732.pdf?arnumber=10195732

Reference9 articles.

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2. Fabrication of Fine Via and Line / Space in Low CTE Film For Panel Fanout Using A Dry Etching Technology;morikawa;IEEE Electronic Components and Technology Conf,2018

3. Novel Isotropic Low Dk/Df film for 5G application

4. A Simple Die-to-Die Bridge Architecture;kono;Proceeding of 32nd Microelectronics Symposium (MES),2022

5. Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

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1. Local Thickness Control of Resist Mask Using Pad Density Dependence;Journal of The Japan Institute of Electronics Packaging;2024-08-01

2. High Precision and Productivity Bridge-die-last Bonding Process and Its Reliability for Pillar- Suspended Bridge (PSB) Architecture;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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