1. Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Voids-free Die-level Cu/ILD Hybrid bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Split Manufacturing Methods;Split Manufacturing of Integrated Circuits for Hardware Security and Trust;2021
4. Spiking Neural Networks Hardware Implementations and Challenges;ACM Journal on Emerging Technologies in Computing Systems;2019-06-04