High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility

Author:

Nogami T.,Bolom T.,Simon A.,Kim B-Y.,Hu C-K.,Tsumura K.,Madan A.,Baumann F.,Wang Y.,Flaitz P.,Parks C.,DeHaven P.,Davis R.,Zaitz M.,Lawrence B. St.,Murphy R.,Tai L.,Molis S.,Rhee S-H.,Usui T.,Cabral C.,Maniscalco J.,Clevenger L.,Li B.,Christiansen C.,Chen F.,Lee T.,Schmatz J.,Shobha H.,Ito F.,Ryan T.,Nguyen S.,Canaperi D.,Arnold J.,Choi S.,Cohen S.,Liniger E.,Chen H-C.,Chen S-T.,Vo T.,Kelly J.,Straten O.,Penny C.,Bonilla G.,Kozlowski P.,Spooner T.,Edelstein D.

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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2. Interconnect Processing: Integration, Dielectrics, Metals;Springer Handbook of Semiconductor Devices;2022-11-11

3. Sputter Processing;Handbook of Thin Film Deposition;2018

4. Copper chemical mechanical planarization (Cu CMP) challenges in 22nm back-end-of-line (BEOL) and beyond;Advances in Chemical Mechanical Planarization (CMP);2016

5. Advanced metallization concepts and impact on reliability;Japanese Journal of Applied Physics;2014-04-22

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