Mechanisms of anodic bonding of silicon to pyrex glass-Reference-Cited by-同舟云学术

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Mechanisms of anodic bonding of silicon to pyrex glass

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Container-title:IEEE Technical Digest on Solid-State Sensor and Actuator Workshop
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Author:

Albaugh K.B.,Cade P.E.,Rasmussen D.H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx2/783/976/00026450.pdf?arnumber=26450

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Anodic bondable Li-Na-Al-B-Si-O glass-ceramics for Si - ULTCC heterogeneous integration;Journal of the European Ceramic Society;2019-07

2. Modified inductively coupled plasma reactive ion etch process for high aspect ratio etching of fused silica, borosilicate and aluminosilicate glass substrates;Sensors and Actuators A: Physical;2018-04

3. High-Speed Ultrasmooth Etching of Fused Silica Substrates in SF₆, NF₃, and H₂O-Based Inductively Coupled Plasma Process;Journal of Microelectromechanical Systems;2015-08

4. Laser-induced fluorescence visualization of ion transport in a pseudo-porous capacitive deionization microstructure;Microfluidics and Nanofluidics;2013-07-09

5. MEMS Processing and Fabrication Techniques and Technology—Silicon-Based Micromachining;Microsystems and Nanotechnology;2012

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