Author:
Zhang Chenchen,Hatipoglu Gokhan,Tadigadapa Srinivas
Funder
Defense Advanced Research Projects Agency through the U.S. Department of Army
subcontract from Honeywell Inc. under DARPA
Corning Inc., Corning, NY, USA, in Annex 2
National Science Foundation through the National Nanotechnology Infrastructure Network
Scientific and Technical Research Council of Turkey through the 2213-International Ph.D. Fellowship
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Cited by
10 articles.
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