HotGauge: A Methodology for Characterizing Advanced Hotspots in Modern and Next Generation Processors-Reference-Cited by-同舟云学术

HotGauge: A Methodology for Characterizing Advanced Hotspots in Modern and Next Generation Processors

Published:2021-11 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International Symposium on Workload Characterization (IISWC)
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Author:

Hankin Alexander¹,Werner David¹,Amiraski Maziar¹,Sebot Julien²,Vaidyanathan Kaushik³,Hempstead Mark¹

Affiliation:

1. Tufts University,Medford,MA,USA

2. Intel Corp.,Hillsboro,OR,USA

3. Google Inc.,Sunnyvale,CA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9668193/9668275/09668287.pdf?arnumber=9668287

Reference50 articles.

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4. Ultra fast (? 1ns) electrical characterization of self-heating effect and its impact on hot carrier injection in 14nm finfets;qu;2017 IEEE International Electron Devices Meeting (IEDM),0

5. Thermal analysis of ultra-thin body device scaling [SOI and FinFet devices]

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