Is the Future Cold or Tall? Design Space Exploration of Cryogenic and 3D Embedded Cache Memory
Author:
Affiliation:
1. Harvard University,Cambridge,MA,USA
2. Amherst College,Amherst,MA,USA
3. Seoul National University,Seoul,Republic of Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10158063/10158070/10158184.pdf?arnumber=10158184
Reference58 articles.
1. NVSim: A Circuit-Level Performance, Energy, and Area Model for Emerging Nonvolatile Memory
2. Hotleakage: A temperature-aware model of subthreshold and gate leakage for architects;zhang,2003
3. A 3T Gain Cell Embedded DRAM Utilizing Preferential Boosting for High Density and Low Power On-Die Caches
4. Case studies in superconducting magnets design and operational issues;yukikazu,2010
5. The heat capacity of pure silicon and germanium and properties of their vibrational frequency spectra
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