Hotspots Elimination and Temperature Flattening in VLSI Circuits
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx5/92/4655424/04636759.pdf?arnumber=4636759
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Boreas: A Cost-Effective Mitigation Method for Advanced Hotspots using Machine Learning and Hardware Telemetry;2023 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS);2023-04
2. Hotspot Mitigation through Multi-Row Thermal-aware Re-Placement of Logic Cells based on High-Level Synthesis Scheduling;2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC);2022-01-17
3. HotGauge: A Methodology for Characterizing Advanced Hotspots in Modern and Next Generation Processors;2021 IEEE International Symposium on Workload Characterization (IISWC);2021-11
4. Exploiting the Benefits of High-Level Synthesis for Thermal-Aware VLSI Design;2019 IEEE 37th International Conference on Computer Design (ICCD);2019-11
5. Machine Learning on the Thermal Side-Channel: Analysis of Accelerator-Rich Architectures;2018 IEEE 36th International Conference on Computer Design (ICCD);2018-10
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