Author:
Knausenberger W.,Schaper L.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
8 articles.
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2. Package Wiring and Terminals;Microelectronics Packaging Handbook;1997
3. Trends in silicon-on-silicon multichip modules;IEEE Design & Test of Computers;1993-12
4. Interconnection and packaging of solid-state circuits;IEEE Journal of Solid-State Circuits;1989-06
5. Multichip packaging and the need for new materials;Journal of Electronic Materials;1989-03