Package Wiring and Terminals
Author:
Publisher
Springer US
Link
http://link.springer.com/content/pdf/10.1007/978-1-4615-4086-1_2.pdf
Reference58 articles.
1. C. W. Ho, D. A. Chance, C. H. Bajorek, and R. E. Acosta. “The Thin-Film Module as a High Performance Semiconductor Package,” IBM J. Res. Develop., 26(3): pp. 286–296, 1982.
2. W. H. Knausenberger and N. A. Teneketges. “High Pinout IC Packaging and the Density Advantage of Surface Mounting,” IEEE Trans. Components, Hybrids, Manuf. Technol., CHMT-6(3): pp. 298–304, 1983
3. D. P. Seraphim and I. Feinberg. “Electronic Packaging Evolution in IBM,” IBM J. Res, Develop., 25(5): pp. 617–629, 1981.
4. I. E. Sutherland and D. Oestreicher. “How Big Should a Printed Circuit Board Be?” IEEE Trans. Computers, C-22: pp. 537–542, 1973.
5. G. Messner. “Cost-Density Analysis of Interconnections,” IEEE Trans. Components, Hybrids, Manuf. Technol., CHMT-10: pp. 143–151, 1987.
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