Trends in silicon-on-silicon multichip modules-Reference-Cited by-同舟云学术

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Trends in silicon-on-silicon multichip modules

Published:1993-12 Issue:4 Volume:10 Page:8-17
ISSN:0740-7475
Container-title:IEEE Design & Test of Computers
language:
Short-container-title:IEEE Des. Test. Comput.

Author:

Frye R.C.,Tai K.L.,Lau M.Y.,Gabara T.J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software,Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx1/54/6310/00245959.pdf?arnumber=245959

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The evolution of silicon photonics as an enabling technology for optical interconnection;Laser & Photonics Reviews;2012-01-17

2. A test methodology for high performance MCMs;Journal of Electronic Testing;1997

3. A Test Methodology for High Performance MCMs;Frontiers in Electronic Testing;1997

4. Planar clock routing for high performance chip and package co-design;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;1996-06

5. A wafer level testability approach based on an improved scan insertion technique;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1995-08

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