Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. R. Rice, “Tutorial on VLSI Packaging,“ IEEE Computer Society Press, 1980.
2. W. H. Knausenberger and L. W. Schaper, IEEE Trans. Components, Hybrids, Manuf. Technol. CHMT-7, 261 (1984)
3. J. W. BÄlde, “Low Dielectric Constant-The substrate of the Future,“ Printed Circuit World Convention IV Technical Paper WCIV-59, June 2-5, 1987.
4. J. W. BÄlde, “Small Dimensions or Low Dielectric Constant-The competing approaches to High Density Interconnect,“ the Mat. Res. Soc. 1987 Fall Meeting, paper I 2.1, Proc. publication in process.
5. E. Davidson, IBM J. Res. Dev. 26, 349 (1982).
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