Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations-Reference-Cited by-同舟云学术

Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations

Published:2014-04 Issue: Volume: Page:
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Container-title:2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Kabakchiev A.¹,Metais B.¹,Ratchev R.¹,Guyenot M.¹,Buhl P.²,Hossfeld M.²,Schuler X.²,Metasch R.³,Roellig M.³

Affiliation:

1. Robert Bosch GmbH, Corporate Research Division, Postfach 300240, 70442 Stuttgart, Germany

2. Materialprüfungsanstalt (MPA) Universtät Stuttgart, Pfaffenwaldering 32, 70569, Germany

3. Fraunhofer Institute for Ceramic Technology and Systems, Material Diagnostics, Dresden, Germany

Publisher

IEEE

Link

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1. FEM Modelling of Ag-Sinter Joints with Respect of Porosity and Sinter Pressure;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25