Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing-Reference-Cited by-同舟云学术

Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing

Published:2022-04-25 Issue: Volume: Page:
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Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Gleichauf Jonas¹,Maniar Youssef¹,Kuczynska Marta²,Metasch Rene³,Roellig Mike³,Wiese Steffen⁴

Affiliation:

1. Robert Bosch GmbH,Corporate Sector Research and Advance Engineering,Renningen,Germany

2. Robert Bosch GmbH,Automotive Electronics Division,Schwieberdingen,Germany

3. Fraunhofer Institute for Ceramic Technologies and Systems,Branch Materials Diagnostics,Dresden,Germany

4. Saarland University,Institute for Microintegration and Reliability,Saarbruecken,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758920.pdf?arnumber=9758920

Reference11 articles.

1. A viscoplastic-fatigue-creep damage model for tin-based solder alloy

2. Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations

3. Optimized TMF measurement setup for reproducible lifetime measurements on solder joints under accelerated thermal-mechanical conditions;roellig;Proc of the 23th International Conference on Thermal Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems,2022

4. Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder Joints

5. a novel thermo-mechanical test method of fatigue characterization of real solder joints;metasch;2009 European Microelectronics and Packaging Conference EMPC,2009

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